ZSSC3170BOARDV2P1S
IDT, Integrated Device Technology Inc
Deutsch
Artikelnummer: | ZSSC3170BOARDV2P1S |
---|---|
Hersteller / Marke: | IDT (Renesas Electronics Corporation) |
Teil der Beschreibung.: | SSC BOARD ZSSC3170 V2.1 WITH SAM |
Datenblätte: | None |
RoHs Status: | Lead free / RoHs compliant |
ECAD -Modell: | |
Zahlungsmittel: | PayPal / Credit Card / T/T |
Versandweg: | DHL / Fedex / TNT / UPS / EMS |
Aktie: |
Ship From: Hong Kong
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
Produkteigenschaften | Eigenschaften |
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Verwendetes IC / Teil | ZSSC3170 |
Art | Interface |
Mitgelieferter Inhalt | Board(s) |
Produkteigenschaften | Eigenschaften |
---|---|
Primärattribute | - |
Funktion | Sensor Signal Conditioner |
Eingebettet | - |
DICE (WAFER SAWN) - WAFFLE PACK
IC INTERFACE
DICE (WAFER SAWN) - FRAME
IC INTFACE SPECIALIZED 32VFQFPN
SSC BOARD ZSSC3154 V1.2 WITH SAM
ZSSC3154 MASS CALIBR. REF. BOARD
IC INTFACE SPECIALIZED 32VFQFPN
ZSSC3154KIT EVALUATION KIT V1.1
IC INTFACE SPECIALIZED SGNL COND
ZSSC3154 MAF SENSOR BOARD V2.11
DICE (WAFER SAWN) - WAFFLE PACK
DICE (WAFER SAWN) - WAFFLE PACK
IC INTFACE SPECIALIZED SGNL COND
ZSSC3154KIT EVALUATION KIT V1.0
ZSSC3154 MASS CALIBRATION SYSTEM
DICE (WAFER SAWN) - FRAME
WAFER (UNSAWN) - BOX
DICE (WAFER SAWN) - FRAME
IC INTFACE SPECIALIZED SGNL COND
WAFER (UNSAWN) - BOX
2024/06/6
2024/04/18
2024/04/13
2023/12/20
![]() ZSSC3170BOARDV2P1SIDT, Integrated Device Technology Inc |
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